Please use this identifier to cite or link to this item:
192.168.6.56/handle/123456789/35160| Title: | Electrical Conductive Adhesives with Nanotechnologies |
| Authors: | Daniel, Yi Li · |
| Keywords: | Electronic packaging Solder and soldering |
| Issue Date: | 2010 |
| Publisher: | Springer Science+Business Media, LLC |
| URI: | http://10.6.20.12:80/handle/123456789/35160 |
| ISBN: | 978-0-387-88783-8 |
| Appears in Collections: | Electrical and Computer Engineering |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Electrical Conductive Adhesives with Nanotechnologies.pdf | 28.62 MB | Adobe PDF | View/Open |
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