Please use this identifier to cite or link to this item:
192.168.6.56/handle/123456789/35160Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Daniel, Yi Li · | - |
| dc.date.accessioned | 2019-01-15T06:09:15Z | - |
| dc.date.available | 2019-01-15T06:09:15Z | - |
| dc.date.issued | 2010 | - |
| dc.identifier.isbn | 978-0-387-88783-8 | - |
| dc.identifier.uri | http://10.6.20.12:80/handle/123456789/35160 | - |
| dc.language.iso | en | en_US |
| dc.publisher | Springer Science+Business Media, LLC | en_US |
| dc.subject | Electronic packaging | en_US |
| dc.subject | Solder and soldering | en_US |
| dc.title | Electrical Conductive Adhesives with Nanotechnologies | en_US |
| dc.type | Book | en_US |
| Appears in Collections: | Electrical and Computer Engineering | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Electrical Conductive Adhesives with Nanotechnologies.pdf | 28.62 MB | Adobe PDF | View/Open |
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