Please use this identifier to cite or link to this item: 192.168.6.56/handle/123456789/36075
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dc.contributor.authorWong, E.-H.-
dc.contributor.authorMai, Y.-W.-
dc.date.accessioned2019-01-17T12:06:37Z-
dc.date.available2019-01-17T12:06:37Z-
dc.date.issued2015-
dc.identifier.isbn978-1-84569-528-6-
dc.identifier.isbn458en_US
dc.identifier.urihttp://10.6.20.12:80/handle/123456789/36075-
dc.language.isoenen_US
dc.publisherElsevier Ltd. All rights reserveden_US
dc.subjectAgainst Mechanical Shock,en_US
dc.titleWoodhead Publishing Series in Electronic and Optical Materials: Number 81 Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moistureen_US
dc.typeBooken_US
Appears in Collections:Electrical and Computer Engineering

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