Please use this identifier to cite or link to this item:
192.168.6.56/handle/123456789/32471| Title: | Die-stacking Architecture |
| Authors: | Xie, Yuan |
| Keywords: | Three-dimensional integrated circuits Computer architecture |
| Issue Date: | 2015 |
| Publisher: | Morgan & Claypool |
| URI: | http://10.6.20.12:80/handle/123456789/32471 |
| ISBN: | 978-1627057660 |
| Appears in Collections: | Electrical and Computer Engineering |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Die-stacking Architecture.pdf | 3.6 MB | Adobe PDF | View/Open |
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