Please use this identifier to cite or link to this item:
192.168.6.56/handle/123456789/32471Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Xie, Yuan | - |
| dc.date.accessioned | 2018-12-28T23:36:02Z | - |
| dc.date.available | 2018-12-28T23:36:02Z | - |
| dc.date.issued | 2015 | - |
| dc.identifier.isbn | 978-1627057660 | - |
| dc.identifier.uri | http://10.6.20.12:80/handle/123456789/32471 | - |
| dc.language.iso | en | en_US |
| dc.publisher | Morgan & Claypool | en_US |
| dc.subject | Three-dimensional integrated circuits | en_US |
| dc.subject | Computer architecture | en_US |
| dc.title | Die-stacking Architecture | en_US |
| dc.type | Book | en_US |
| Appears in Collections: | Electrical and Computer Engineering | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Die-stacking Architecture.pdf | 3.6 MB | Adobe PDF | View/Open |
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