Please use this identifier to cite or link to this item:
192.168.6.56/handle/123456789/32239
Title: | Modelling and Simulation in Thermal and Chemical Engineering A Bond Graph Approach |
Authors: | Thoma· B, J |
Keywords: | Chemical Engineering |
Issue Date: | 2008 |
Publisher: | Springer-Verlag Berlin Heidelberg |
URI: | http://10.6.20.12:80/handle/123456789/32239 |
ISBN: | 978-3-642-08566-6 228 |
Appears in Collections: | Electrical and Computer Engineering |
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