Please use this identifier to cite or link to this item:
192.168.6.56/handle/123456789/32239
Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Thoma· B, J | - |
dc.date.accessioned | 2018-12-28T06:53:27Z | - |
dc.date.available | 2018-12-28T06:53:27Z | - |
dc.date.issued | 2008 | - |
dc.identifier.isbn | 978-3-642-08566-6 | - |
dc.identifier.isbn | 228 | en_US |
dc.identifier.uri | http://10.6.20.12:80/handle/123456789/32239 | - |
dc.language.iso | en | en_US |
dc.publisher | Springer-Verlag Berlin Heidelberg | en_US |
dc.subject | Chemical Engineering | en_US |
dc.title | Modelling and Simulation in Thermal and Chemical Engineering A Bond Graph Approach | en_US |
dc.type | Book | en_US |
Appears in Collections: | Electrical and Computer Engineering |
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