Please use this identifier to cite or link to this item:
192.168.6.56/handle/123456789/35167| Title: | Electrical Design of Through Silicon Via |
| Authors: | Lee, Manho |
| Keywords: | Three-dimensional integrated circuits Design and construction |
| Issue Date: | 2014 |
| Publisher: | Springer Science+Business Media Dordrecht |
| URI: | http://10.6.20.12:80/handle/123456789/35167 |
| ISBN: | 978-94-017-9038-3 |
| Appears in Collections: | Electrical and Computer Engineering |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Electrical Design of Through Silicon Via.pdf | 12.74 MB | Adobe PDF | View/Open |
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