Please use this identifier to cite or link to this item:
192.168.6.56/handle/123456789/15945| Title: | 3D Microelectronic Packaging |
| Authors: | Li, Yan |
| Keywords: | Microelectronic packaging|Materials science ; Electronic devices & materials ; Circuits & components ; Precision instruments manufacture |
| Issue Date: | 2017 |
| Publisher: | Springer International Publishing Switzerland |
| URI: | http://10.6.20.12:80/handle/123456789/15945 |
| ISBN: | 978-3-319-44586-1 |
| Appears in Collections: | Electrical and Computer Engineering |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 3D Microelectronic Packaging From Fundamentals to Applications.pdf | 21.37 MB | Adobe PDF | View/Open |
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