Please use this identifier to cite or link to this item:
192.168.6.56/handle/123456789/51786| Title: | Advanced Materials for Thermal Management of Electronic Packaging |
| Authors: | Xingcun, Colin Tong |
| Keywords: | Springer Science+Business Media |
| Issue Date: | 2011 |
| Publisher: | Springer Science+Business Media |
| URI: | http://10.6.20.12:80/handle/123456789/51786 |
| ISBN: | 978-1-4419-7759-5 |
| Appears in Collections: | Human Resource, Logistics & Supply Chain Management |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 16 2011.pdf | 14.86 MB | Adobe PDF | View/Open |
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