Please use this identifier to cite or link to this item:
192.168.6.56/handle/123456789/15945Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.editor | Li, Yan | - |
| dc.date.accessioned | 2018-10-30T11:11:09Z | - |
| dc.date.available | 2018-10-30T11:11:09Z | - |
| dc.date.issued | 2017 | - |
| dc.identifier.isbn | 978-3-319-44586-1 | - |
| dc.identifier.uri | http://10.6.20.12:80/handle/123456789/15945 | - |
| dc.language.iso | en | en_US |
| dc.publisher | Springer International Publishing Switzerland | en_US |
| dc.subject | Microelectronic packaging|Materials science ; Electronic devices & materials ; Circuits & components ; Precision instruments manufacture | en_US |
| dc.title | 3D Microelectronic Packaging | en_US |
| dc.type | Book | en_US |
| Appears in Collections: | Electrical and Computer Engineering | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 3D Microelectronic Packaging From Fundamentals to Applications.pdf | 21.37 MB | Adobe PDF | View/Open |
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